Stepwise grafting polyethyleneimine onto silica surface for Cu(II) removal

Authors

  • Mahmoud Elsayed Hafez Beni-Suef University, Beni-Suef, Egypt
  • Thanh-Thuy Mai Thi Institute of Chemistry, Vietnam Academy of Science and Technology, Hanoi, Vietnam
  • Van-Tuan Mai Electric Power University, Hanoi, Vietnam
  • Thuy-Tien Do Hanoi Pedagogical University 2, Vinh Phuc, Vietnam
  • Thu-Huyen Dang Thi Hanoi Pedagogical University 2, Vinh Phuc, Vietnam
  • Phuong-Uyen Pham Hanoi Pedagogical University 2, Vinh Phuc, Vietnam
  • Hai-Yen Vu Thi Hanoi Pedagogical University 2, Vinh Phuc, Vietnam
  • Quynh-Mai Le Hanoi Pedagogical University 2, Vinh Phuc, Vietnam
  • The-Duyen Nguyen Hanoi Pedagogical University 2, Vinh Phuc, Vietnam

DOI:

https://doi.org/10.56764/hpu2.jos.2024.3.3.20-26

Abstract

Polyethyleneimine (PEI) is a novel polymer that contains multiple amine groups that are suitable for chelation with many heavy metal ions (HMI). Anchoring PEI onto the surface of a solid substrate has been widely adopted to develop adsorbent materials with the hope of combining the HMI chelating ability of PEI with the heterogeneity of the substrate. Herein, the preparation of PEI grafted SiO2 (PEI/SiO2) has been demonstrated by a stepwise method in which SiO2 nanoparticles were functionalized with 3-glycidoxypropyltrimethoxysilane (KH560) followed by refluxing with PEI. The method could provide PEI/SiO2 material with 23.4% of PEI by weight. Studying the adsorption properties of PEI/SiO2 with Cu(II) revealed that the adsorption of Cu(II) ions on PEI/SiO2 followed Langmuir and Dubinin-Radushkevich models and included both chemisorption and physisorption. The adsorption capacity was about 25.3-27.3 mg/g. The stepwise method demonstrated in this study may be adopted to fabricated PEI based materials for HMI removal.

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Published

30-12-2024

How to Cite

Hafez, M. E., Mai Thi, T.-T., Mai, V.-T., Do, T.-T., Dang Thi, T.-H., Pham, P.-U., Vu Thi, H.-Y., Le, Q.-M., & Nguyen, T.-D. (2024). Stepwise grafting polyethyleneimine onto silica surface for Cu(II) removal. HPU2 Journal of Science: Natural Sciences and Technology, 3(3), 20–26. https://doi.org/10.56764/hpu2.jos.2024.3.3.20-26

Volume and Issue

Vol. 3 No. 3 (2024): HPU2.Nat.Sci.Tech

Section

Natural Sciences and Technology

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Copyright (c) 2024 Mahmoud Elsayed Hafez, Thanh-Thuy Mai Thi, Van-Tuan Mai, Thuy-Tien Do, Thu-Huyen Dang Thi, Phuong-Uyen Pham, Hai-Yen Vu Thi, Quynh-Mai Le, The-Duyen Nguyen

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